Publication: A Design Kit for High Temperature ASIC and LTCC Co-Design

Posted on

Ozark IC’s work in advanced packaging for high-temperature integrated circuits was a feature in the November/December issue of Advancing Microelectronics Magazine (an IMAPS publiction).

A Design Kit for High Temperature ASIC and LTCC Co-Design

Jim Holmes, A. Matt Francis, Ian Getreu, Matthew Barlow, Nick Chiolino, Michael Glover

Leave a Reply

Your email address will not be published. Required fields are marked *