Let Ozark IC be your advanced packaging provider.
We know how hard it is to find a domestic partner for advanced electronics packaging and assembly services. That's why we built our own. Let us share our experience to provide you with the fabrication expertise you need to bring your finished products to life at the volumes and time frames you really need.
We have years of experience developing rugged, wide temperature packaging for our own products. We know what it takes to turn your ICs into a complete product, and we are able to offer quick turnaround and small batch services for prototype development whether your environmental needs are extreme or not.
High-Temperature Substrate Technologies
- Co-fired & post-fired ceramic
- Single & multiple layer
- Gold finish metals, wire bondable, solderable
- Laser trimming, marking available
- Screen printing & additive manufacturing
Wire Bonding Capabilities
- Gold and aluminum 0.7 to 2 mil diameter
- Supporting standard and custom packaging
Die Attach & SMD Attach
- Epoxy attach, conductive or nonconductive
- Solder attach up to 400°C
- Sintering attach, copper or gold
Additional Services
- Quick turn breakout boards
- Flip chip attach
- Potting and encapsulation
- Custom enclosure design
- Physical testing capabilities
