In the News

  • In addition to his role at Ozark, CEO Matt Francis is also giving back by serving on the Board of Directors of IEEE, the largest technical professional organization in the world. As a 501c3 with over 460,000 members, IEEE is dedicated to advancing technology for the benefit of humanity. Matt serves as the 2024-2025 Director for IEEE Region 5, the US Southwest, where he has had the opportunity to promote educational, technical and policy initiatives and support the professional growth of technical professionals throughout the US and the world. We are excited to see the continued impact of his efforts and fellow volunteers in shaping the next generation of technical professionals and innovators. https://spectrum.ieee.org/ieee-bod-sept-2024

  • Location: Fayetteville, AR Company: Ozark Integrated Circuits, Inc. Job Summary: We are seeking an enthusiastic and detail-oriented Information Systems Specialist Intern to join our team. This internship offers hands-on experience in various aspects of information systems management and IT support. The ideal candidate will be eager to learn, possess strong analytical skills, and contribute to projects that enhance our systems and processes. Key Responsibilities: The following roles and responsibilities will be trained: Install, configure, troubleshoot, and maintain network systems and services Install, configure, and perform maintenance on virtual environments inside of Ozark IC’s network Learn the basics of NIST 800-171 and NIST 800-37 and work with the Cybersecurity Officer to make sure technical controls are implemented. Work with the Information Systems Coordinator to verify and automate backup schemes Research equipment and provide input for additions to Ozark IC’s network Aid end users in troubleshooting, diagnostics, and resolution in support of lab operations Perform general administration of Windows and Linux Workstations Communicate effectively in writing to create process documentation and guides Qualifications: An applicant must meet ALL below criteria. The applicant must: Be a junior or senior majoring in a Bachelor of Management Information Systems, Computer Science, or a similar major Be available to work at least 20 hours per week during the semester if in school Be legally eligible for employment in the United States Preferred Skills: The following are preferred, but not a requirement. It is not expected for an applicant to have all qualifications. These skills will be learned and enhanced while on the job. An applicant should be confident in their ability to learn if they do not have any of the preferred skills. Familiar with Windows Server and/or the Ubuntu Operating System Good written and oral communication skills Knowledge of basic SQL queries and how to read database ERDs Familiar with a programming language. Python is a plus. Fundamental networking knowledge. Able to identify and explain what network appliances do. Knowledge of NIST 800-171, NIST 800-53, NIST 800-37, NIST CSF 2.0 All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran. Salary & Benefits: Salary will be determined based on the candidate’s specific skills, experience, and qualifications. Gain practical experience in a professional setting. Mentorship from experienced professionals in the field. Networking opportunities within the company. Potential for future employment opportunities. How to apply: Complete the job application available at www.ozarkic.com/jobs.  

  • Location: Fayetteville, AR Company: Ozark Integrated Circuits, Inc. Job Summary: We are seeking an experienced Electronics Packaging Lead/Manager to lead our advanced packaging manufacturing team. This role is critical in overseeing the design, development, and execution of packaging solutions for electronic components. The ideal candidate will have a strong background in packaging engineering, materials science, and project management, ensuring our products meet quality, cost, and time-to-market objectives. Key Responsibilities: Leadership: Manage and mentor a team of packaging engineers and technicians, fostering a collaborative and innovative work environment. Packaging Design: Oversee the design and development of advanced packaging solutions, ensuring compatibility with product specifications and regulatory requirements. Process Optimization: Evaluate and improve existing packaging processes, focusing on efficiency, quality, and sustainability. Collaboration: Work closely with R&D, production, and supply chain teams to integrate packaging solutions into product development cycles. Quality Assurance: Develop and implement testing protocols to ensure packaging durability and reliability under various environmental conditions. Material Selection: Research and select appropriate materials for packaging that balance performance, cost, and environmental impact. Project Management: Lead cross-functional projects, managing timelines, budgets, and resource allocation effectively. Compliance: Ensure all packaging meets industry standards and regulatory requirements, maintaining accurate documentation and records. Cost Management: Analyze packaging costs and identify opportunities for cost savings while maintaining quality standards.     Qualifications: Bachelor’s degree in Packaging Engineering, Materials Science, Mechanical Engineering, or related field; Master’s degree preferred. Minimum of 5 years of experience in electronics packaging or related field, with a focus on advanced packaging technologies. Strong knowledge of packaging materials, manufacturing processes, and testing methodologies. Proven track record of successful project management and team leadership. Excellent problem-solving skills and attention to detail. Strong communication and interpersonal skills to effectively collaborate with cross-functional teams. Familiarity with industry standards and regulations related to electronics packaging (e.g., IPC, ASTM). Preferred Skills: Experience with sustainable packaging practices and materials. Proficiency in CAD software and packaging simulation tools. Python experience a plus. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran. Salary & Benefits Salary will be determined based on the candidate’s specific skills, experience, and qualifications. Flexible & hybrid work options Paid Time Off Benefits Package How to apply: Complete the application form available at www.ozarkic.com/jobs. Applications due by December 9, 2024.

  • Location: Fayetteville, AR Company: Ozark Integrated Circuits, Inc. Job Summary: The applications engineer at Ozark Integrated Circuits, Inc. is responsible for designing circuit schematics, completing hardware circuit layouts, and creating embedded software for extreme environment product efforts focused on the needs of commercial end users.  The applications engineer will play a key role in product development and the expansion of Ozark Integrated Circuits, Inc. single board computers into new technology areas and markets.  The applications engineer will assist in the assessment of new customer and product specifications, feasibility, and risk analysis, and discuss application needs with potential customers.  In addition to hardware and software design, testing, and maintenance, the applications engineer will also be heavily involved in new product development and product lifecycle management efforts. Key Responsibilities: Responsibilities will include assisting in the generation of project proposals, understanding and managing market and product requirements, and in the creation of high-level system concept models and architecture/functional block diagrams. Create customer centric solutions for new applications and for continuous improvement of existing products. Work with engineering group, customers, and commercial partners to develop new product ideas and applications. Define application and product requirements and assess compatibility with Ozark IC computing modules and related technologies. Work with the team to develop C&F designs, block diagrams, and BOMs; Drive design reviews and validation testing, and provide recommendations on feasibility Develop test plans and protocols for module characterization. Utilize design for manufacturability, design for assembly, design for cost and tools and principles, and ensure adherence to a robust PLM process. Communicate plans and results effectively. Provide technical reports and presentations to internal and external project stakeholders. Qualifications: Bachelor’s degree in electrical engineering or equivalent experience Circuit and PWB design experience and related EDA tool experience. Electrical device test and analysis. Excellent oral and written communication skills for customer engagement. Superior analytical and problem-solving skills. Understanding of risk management. Ability to work under pressure and deliver on-time in a fast-paced, dynamic environment Ability and willingness to travel domestically and internationally, as needed Preferred Skills: Experience in electrical schematic design, printed wiring board layout and tools. Experience in embedded programming, computer systems, and programming languages (e.g. C/C++) to develop required product applications. Experience in product qualification, testing and characterization, and necessary improvements. Communication and interpersonal skills for internal and customer interaction. Organization and attentiveness to detail to ensure all parts of design through application address customer needs and to provide design organization and circuit block modularity. Salary & Benefits Salary will be determined based on the candidate’s specific skills, experience, and qualifications. Flexible & hybrid work options Paid Time Off Benefits Package How to apply: Complete the job application available at www.ozarkic.com/jobs. Applications due by December 13, 2024.

  • November 23, 2024 – We are no longer accepting applications for this position. We are currently reviewing applications and will follow up with finalists for next steps in the next two weeks. Location: Fayetteville, AR Company: Ozark Integrated Circuits, Inc. Job Summary: We are seeking a motivated and enthusiastic Summer Engineering Intern to join our team. The intern will gain hands-on experience in high temperature electronics design and/or packaging, working closely with experienced professionals in a dynamic environment during a 10-week internship Key Responsibilities: The following roles and responsibilities will be trained: Assist in systems modeling, testing, and circuit design, fabrication, and packaging. Participate in team meetings and contribute to project brainstorming sessions. Support the development and testing of new packaging strategies. Analyze data and present findings to the team. Document and report on progress and challenges encountered during projects. Qualifications: An applicant must meet ALL below criteria. The applicant must: Currently pursuing a degree in Mechanical, Engineering, Electrical Engineering, or Computer Science/Engineering Strong analytical and problem-solving skills. Excellent communication and teamwork skills. Ability to work independently and manage time effectively Be legally eligible for employment in the United States Salary & Benefits: Salary will be determined based on the candidate’s specific skills, experience, and qualifications. Gain practical experience in a professional setting. Mentorship from experienced professionals in the field. Networking opportunities within the company. Potential for future employment opportunities. Housing and travel allowance is available. How to apply: To apply, please complete the job application and submit your resume and a cover letter outlining your interest in the internship and relevant skills at www.ozarkic.com/jobs. Applications will be accepted until November 22, 2024. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.  

  • We are looking forward to contributing to the discussions at the IEEE-USA Packaging Chips with CHIPS Summit. It’s an exciting opportunity to engage with leading experts in the field and explore the latest advancements in packaging to support semiconductor manufacturing at both the technical and policy level and to collaborate on innovative solutions to continue to drive the industry forward. https://chips.ieeeusa.org/pcwc-2024/

  • The U.S. Department of Energy (DOE) has announced selections totaling $142 million for 123 small business projects for research in multiple areas, including clean energy and decarbonization. We are thrilled to share that the Geothermal Technologies Office (GTO) has selected Ozark Integrated Circuits, Inc. for a grant of $1.1 million to advance our work on high-temperature flow rate instruments for geothermal reservoir monitoring using the Ozark IC eXtreme Node® (or XNode®) single board computer, which can operate in the extreme conditions experienced in Energy exploration, Aerospace, Space Exploration, and Industrial Controls. This project tackles the challenges of increasing reliability and functionality of high temperature electronics, specifically in fracture zone management. A big step forward in geothermal technology! Read the full press release from the Geothermal Technologies Office at https://content.govdelivery.com/accounts/USEERE/bulletins/3b2cea9

  • Ozark IC is gearing up to share his insights at the ARPA-E Workshop this October 1st in Alexandria, VA. This event will focus on exploring the potential of superhot geothermal power stations for electricity generation and other uses. Look for CEO @Matt Francis at the 4pm panel discussion on Wednesday. https://arpa-e.energy.gov/events/enabling-transformative-technoogies-for-superhot-geothermal-workshop

  • Join us at TETS for an exciting Ozark IC showcase! Stop by our booth in the Exhibit Hall where we’ll be demonstrating our latest XNode innovations. And don’t miss Ozark IC Engineer Brandon Dyer, on Thursday, September 12 during the Electrical Machines – Motors/Generators workshop. He’ll be sharing insights from Ozark IC’s latest engine testing of 350°C XNodes® at his 9:10am session. Can’t wait to see you there! https://tets.us/

  • Ozark IC CEO, Dr. A. Matt Francis, will speak at the IEEE National Aerospace and Electronics Conference on Wednesday, July 17, 2024. In his 8am session titled “Extending the Limits: Computing and Advanced Electronics at High Temperature,” Dr. Francis will discuss the latest advancements in advanced packaging for silicon and silicon-carbide semiconductors, introducing new system tradeoffs within the temperature range of 200 to 800C. https://attend.ieee.org/naecon-2024/