Truly Rugged Electronics
Built for 200°C and Beyond
We bring the power of computing to everywhere it isn't - providing a complete solution on a modular platform. We utilize advanced manufacturing and rapid customization to create modules that are small, light, and cost effective.
The resulting products – Ozark IC’s XNode® family – provide solutions spanning aerospace, energy, industrial and space applications, helping to solve the hardest problems on and off the Earth.
Enabling Connectivity at Any Temperature
in Any Environment
UV Sensing on the ISS
In 2019, we were given the incredible opportunity to send several of our XNode® UV-100 modules to the International Space Station to test their sensing capabilities in low-Earth orbit.
Dashboard showing data collected in real time from two of the UV-100s while on the ISS.
The result? Not only did they perform flawlessly, earning a Technology Readiness Level (TRL) of 9, we have since developed the UV-100 into a general-purpose platform for real-time characterization of semiconductor devices and sensors in space.
Do you need electronics packaging, test or design services? US-based and secure? While 2025 was a VERY busy year, Ozark Integrated Circuits, Inc. was very proud to have completed two key programs and…
FAYETTEVILLE, ARKANSAS MAY 2025 – Ozark Integrated Circuits, Inc. (Ozark IC) will be traveling to Paris, France June 16 to 22 to participate in the 2025 Paris…
Ozark Integrated Circuits, Inc. (Ozark IC) recently achieved Cybersecurity Maturity Model Certification Status Final Level 2 (C3PAO)…
In addition to his role at Ozark, CEO Matt Francis is also giving back by serving on the Board of Directors of IEEE, the largest technical professional organization in the world.…
We are looking forward to contributing to the discussions at the IEEE-USA Packaging Chips with CHIPS Summit. It's an exciting opportunity to engage with leading experts…
