Advanced packaging:
At high temp, the chips only scratch the surface
Ozark IC’s design capability doesn’t end at the IC – we co-design chips and substrates for wide temperature operation
- Ceramic substrates based on LTCC technology for extended operation up to 300°C and custom options for designs up to 500°C
- Quick-turn prototyping system (weeks, not months)
- Co-design of chip/package/substrate
- Circuits scalable from gate drivers to microcontrollers
- Designs from -180°C to 500°C
