Ozark IC to attend Packaging Chips with CHIPS Summit

We are looking forward to contributing to the discussions at the IEEE-USA Packaging Chips with CHIPS Summit. It’s an exciting opportunity to engage with leading experts in the field and explore the latest advancements in packaging to support semiconductor manufacturing at both the technical and policy level and to collaborate on innovative solutions to continue to drive the industry forward. https://chips.ieeeusa.org/pcwc-2024/