Ozark IC to attend Packaging Chips with CHIPS Summit

We are looking forward to contributing to the discussions at the IEEE-USA Packaging Chips with CHIPS Summit. It’s an exciting opportunity to engage with leading experts in the field and explore the latest advancements in packaging to support semiconductor manufacturing at both the technical and policy level and to collaborate on innovative solutions to continue to drive the industry forward. https://chips.ieeeusa.org/pcwc-2024/

Ozark IC at TETS 2024

Join us at TETS for an exciting Ozark IC showcase! Stop by our booth in the Exhibit Hall where we’ll be demonstrating our latest XNode innovations. And don’t miss Ozark IC Engineer Brandon Dyer, on Thursday, September 12 during the Electrical Machines – Motors/Generators workshop. He’ll be sharing insights from Ozark IC’s latest engine testing of 350°C XNodes® at his 9:10am session. Can’t wait to see you there! https://tets.us/

Ozark IC at NAECON 2024

Ozark IC CEO, Dr. A. Matt Francis, will speak at the IEEE National Aerospace and Electronics Conference on Wednesday, July 17, 2024. In his 8am session titled “Extending the Limits: Computing and Advanced Electronics at High Temperature,” Dr. Francis will discuss the latest advancements in advanced packaging for silicon and silicon-carbide semiconductors, introducing new system tradeoffs within the temperature range of 200 to 800C. https://attend.ieee.org/naecon-2024/

Look for us at IEEE MTT-S International Microwave Symposium

Ozark IC will be at the IEEE MTT-S International Microwave Symposium on Sunday, June 16. During the morning workshop, “Operating at the Extreme: RFIC Design Techniques for Operation Beyond the PDK Limits,” CEO Matt Francis will present a tutorial on the Design of Electronics at High Temperature, addressing the challenges and opportunities for design in emerging technologies in electronics operating about 150C. We hope to see you there. https://ims-ieee.org/technical-program/workshops?date=2024-06-16

Ozark IC at CERAWeek

The Energy Venture Day and Pitch Competition co-hosted by Rice Alliance for Technology and Entrepreneurship, Houston Energy Transition Initiative (HETI), and TEX-E is an exciting, fast-paced event that brings together 40+ energy ventures with investors, corporations, and the energy community. We were selected as a participating energy venture and look forward to sharing more about our company. You have two opportunities to see our pitch. At CERAWeek, join us on March 20th in the Innovation Agora. On 3/19, see us at the Ion Houston for the Pitch Preview (free to attend). For more info and to register: alliance.rice.edu/evd

Ozark IC at WiPDA US

CEO Matt Francis looks forward to presenting at a dynamic IEEE WiPDA US 2023 workshop representing Ozark Integrated Circuits, Inc. #Widebandgap continues to make strides in power for greening our grid/transportation and moving us beyond silicon in adjacent spaces like rugged devices. CEO Francis and fellow panelists will discuss the opportunities of WBG in agriculture, EV charging, energy exploration, and aerospace. https://wipda.org/

Ozark IC CEO to speak at DARPA ERI 2.0 Summit

Ozark IC is excited to announce that Matt Francis, its Founder, President and CEO, will be giving a Lightning Talk on High Temperature Electronics at the upcoming DARPA Electronics Resurgence Initiative (ERI 2.0) Summit to be held in Seattle on August 22-24, 2023. ERI is pursuing focused research in two basic areas: 1) Manufacturing complex 3D microsystems and 2) Developing electronics for extreme environments. In many emerging aerospace applications, high temperature is the intersection of these worlds, and Dr. Francis will speak on the state of the art, the opportunities and the challenges to enabling next-generation #energy and #aerospace applications.

Ozark IC Heading to GOMACTech-23

Ozark IC will be in attendance at GOMACTech-23 March 20-23, 2023 in San Diego, CA. Our booth in the exhibition area will feature our latest XNode™ single-board computer products and services. You can also find us at the Wednesday session on thermally hardened electronics, where CEO Dr. Matt Francis will present our work on scaling electronics to extreme environments, from 200 ℃ to 800 ℃. Session Info: https://www.scomminc.com/pcm/collectsubmissions/sessionList.cfm?CFID=1791338&CFTOKEN=272a392ce57f5761-A0390255-0A0A-669F-795D42DA962BDF72