Ozark IC is attending the 2019 Government Microcircuit Applications and Critical Technology Conference in Albuquerque, NM this week March (25-28, 2019) . Attending? If you have interest in setting up a one on one, please email info@ozarkic.com to make an appointment to discuss high temperature electronics, packaging and test.
Ozark IC presented it’s work in high and ultra-high temperature packaging at the 2018 Turbine Engine Symposium in Dayton, OH on Sept. 15th, 2018.
Thanks to everyone who visited Ozark IC at our table at the 2018 High Temperature Electronics Conference! It was a great conference and we look forward to attending in 2020! May 8-10, 2018 Hotel Albuquerque Albuquerque, New Mexico USA http://www.imaps.org/hitec
Ozark IC’s work in design and qualification of silicon carbide technology was featured at the 2015 Aerospace Conference. Francis, A. M., Moudy, T., Holmes, J. A., Rahman, A., Barlow, M., Ahmed, S., & Mantooth, A. (2015). Towards standard component parts in silicon carbide CMOS. In 2015 IEEE Aerospace Conference (pp. 1–9). https://doi.org/10.1109/AERO.2015.7119291 Dr. Alan Mantooth, of the University of Arkansas also presented a paper on SiC analog/mixed-signal designs done by student Ashfaq Rahman as further part of our SiC collaborations Rahman, A., Shepherd, P. D., Bhuyan, S. A., Ahmed, S., Akula, S. K., Caley, L.,Francis, A.M. Holmes, J. A. (2015). A family of CMOS analog and mixed signal circuits in SiC for high temperature electronics. In Aerospace Conference, 2015 IEEE […]
