Let Ozark IC be your advanced packaging provider.
We know how hard it is to find a domestic partner for advanced electronics packaging and assembly services. That's why we built our own. Let us share our experience to provide you with the fabrication expertise you need to bring your finished products to life at the volumes and time frames you really need.
We have years of experience developing rugged, wide temperature packaging for our own products. We know what it takes to turn your ICs into a complete product, and we are able to offer quick turnaround and small batch services for prototype development whether your environmental needs are extreme or not.
High-Temperature Substrate Technologies
- Co-fired & post-fired ceramic substrates
- Single & multi-layer solutions
- Gold finish metals, wire bondable, flip chip, solderable
- Laser trimming, marking available
- Screen printing & additive manufacturing
Interconnection Capabilities
- Gold and aluminum 0.7 to 2 mil diameter
- Flip chip, gold stud bonding capabilities
- Supporting standard and custom packaging
Die Attach & SMD Attach
- Low void vacuum solder attach up to 400°C, preforms or paste
- Epoxy attach, conductive or nonconductive, low outgassing, standard materials or exotic high temperature options
- Solder attach up to 400°C
- Copper or gold sintering attach for die or components
Additional Services
- Quick turn breakout boards
- Flip chip attach
- Potting and encapsulation
- Custom enclosure design
- Physical testing capabilities
- MIL-SPEC thermal cycling
- High temperature testing up to 1000 °C
- Low temperature testing to -100 °C
- Shock and Vibration Testing
- Electrical Testing
- Hot Chuck Probe testing to 400 °C
- Extreme environment testing
- High speed switching and RF Device testing
