A Design Kit for High Temperature ASIC and LTCC Co-Design
Ozark IC’s work in advanced packaging for high-temperature integrated circuits was a feature in the November/December issue of Advancing Microelectronics Magazine (an IMAPS publiction). A Design Kit for High Temperature ASIC and LTCC Co-Design Jim Holmes, A. Matt Francis, Ian Getreu, Matthew Barlow, Nick Chiolino, Michael Glover