A Design Kit for High Temperature ASIC and LTCC Co-Design
Ozark IC’s work in advanced packaging for high-temperature integrated circuits was a feature in the November/December issue of Advancing Microelectronics Magazine (an […]
Month: December 2016
Ozark IC’s work in advanced packaging for high-temperature integrated circuits was a feature in the November/December issue of Advancing Microelectronics Magazine (an […]