Advanced Packaging

Advanced Packaging

Advanced packaging:

At High temp, the chips only scratch the surface

Ozark IC’s design capability doesn’t end at the IC – we co-design chips and substrates for wide temperature operation

  • Ceramic substrates based on LTCC technology for extended operation up to 300 C and custom options for designs up to 500 C
  • Quick-turn prototyping system (weeks, not months)
  • Co-design of chip/package/substrate à Works right, the first time
  • Circuits scalable from gate drivers to microcontrollers
  • Designs from -180 C to 500 C