What goes into an electronic module?

A complete module is composed of Components, a Board (Substrate) and of course application software and programming depending on the system.

Putting a system together is driven by your application needs.  The technologies that go into an electronic module include the component parts, the substrate/board system and the methods used to assemble these technologies into a complete module (Packaging/Assembly)

 Which technology is right for me?

The technology you use for each module assembly step is driven by your requirements - cost, temperature, humidity, vibration, voltage range...  the priority of these (and many more) requirements will naturally drive which technology you utilize for your application.


Board/Substrate Systems

The vast majority of electronic systems are built on epoxy/polymers and composites.  These technologies are tried and true in "standard" temperature ranges and offer very good density at low costs.  Depending on your application, boards from 1 or 2 layers to 4 or more can be designed, manufactured and verified in weeks.  Options include surface finishes, board system (e.g. FR4, Polyimide and others) and level of qualification/testing.

Higher temperature operation is where these traditional systems begin to fail.  Almost all systems contain volatile organics which begin to burn out at higher temperatures (> 125/200 C depending on material).  At these temperatures ceramic-based systems make sense.

Integrated Circuits and Components

The VAST majority of components on the market are based on Silicon technology.  The decades of investment in silicon means you can embed truly incredible capability into your system at very low cost.

However, silicon beginsto "run out of steam" at temperatures above 125 C, as leakage dominates.  Technologies like silicon-on-insulator can extend operational ranges to 225 C (and beyond, for limited operational times).  Wide-bandgap technologies begin to make sense we you need their special attributes, including higher temperature operation (up to 600 C) or UV light sensitivity.

Putting it all Together: Assembly and Packaging

The devil is in the details.  Having the right components and substrate only gets you so far if you don't have the right, reliable methods to combine everything into a complete electronic module.  Ozark IC can help you identify the right methods, from standard solders to advanced high-temperature epoxies and custom packages and assemblies.