Ozark IC joins the Arkansas Advanced Energy Association
In support of clean energy applications of its SiC technologies, Ozark IC is happy to announce it has joined the Arkansas Advanced Energy Association!
Visit Ozark IC at the Fayetteville “Startup Crawl”
Ozark IC is excited to participate in the Fayetteville Startup Crawl! The Startup Crawl is the biggest startup party of the year highlighting the Downtown Innovation District in the Startup City of the South. Everyone is invited to come out and tour local startups at this incredible, one-night celebration of technology and entrepreneurship! Get ready to crawl your way through Fayetteville and experience fun, food, live music, and the best that the City has to offer. Local breweries will be set up at every stop! Register today! https://www.eventbrite.com/e/startup-crawl-tickets-36490104886
Ozark IC announces new projects with the US Air Force and Department of Energy
Ozark Integrated Circuits Inc., a technology firm located in the Arkansas Research and Technology Park at the University of Arkansas, has received a $750,000 award from the U.S. Air Force. The grant is to develop electronics packaging and assembly systems for controls in jet engines. The controls can operate at temperatures up to 300 degrees Celsius. The Fayetteville-based company will continue collaborating with researchers at the University of Arkansas’ High Density Electronics Center, or HiDEC, also located at the technology park. U of A researchers involved in the project are Simon Ang, HiDEC director and professor of electrical engineering; and Silke Spiesshoefer, clinical assistant professor of electrical engineering. Read More…. https://www.newswise.com/articles/ozark-integrated-circuits-receives-750-000-award-from-air-force http://www.arkansasonline.com/news/2017/jul/19/news-in-brief-20160719/?f=business http://news.uark.edu/articles/39133/ozark-integrated-circuits-receives-750-000-award-from-air-force
Ozark IC – Doing Business with NASA Event
Ozark IC attended and discussed our work with NASA at ASBTDC’s “Doing Business with NASA” event Thursday, July 20th. http://ualr.edu/news/2017/06/19/doing-business-with-nasa/
Engineering the Future – Ozark IC on Startup Junkies Podcast
94: Engineering the Future with Ozark IC Jul 17, 2017 If you like engineering, then you’re going to love this one! This week we welcome Matt & Jim from Ozark IC. We discuss their work with semiconductors, and how the future is powered by engineering. Their company has received grants from NASA, so they know what they’re talking about. Read more at http://startupjunkie.libsyn.com/94-engineering-the-future-with-ozark-ic#LSgllT0rViRqtxUB.99
See you at OTC 2017!
Come visit us at the NASA booth (5318) at the Offshore Technology Conference • 1-4 May 2017 • NRG Park • Houston, Texas, USA. Ozark IC CTO Jim Holmes will be attending this week to discuss Ozark IC’s SiC technologies for downhole exploration.
High Temperature Data Converters in Silicon Carbide CMOS
Congrats to Ashfaq Rahman (PhD student of Dr. Alan Mantooth), a member of the U of A/Ozark IC design team from the Building Innovation Capacity NSF collaboration on his new paper, “High Temperature Data Converters in Silicon Carbide CMOS,” that has been posted to the “Early Access” area on IEEEXplore! Rahman, A., Caley, L., Roy, S., Kuhns, N., Mantooth, A., Di, J., … Holmes, J. (2017). High Temperature Data Converters in Silicon Carbide CMOS. IEEE Transactions on Electron Devices, 64(4), 1426–1432. https://doi.org/10.1109/TED.2017.2665520
Extended High-Temperature Operation of Silicon Carbide CMOS Circuits for Venus Surface Application
Ozark IC’s work in Silicon Carbide CMOS integrated circuits was recently featured in the IMAPS Journal of Microelectronics and Electronic Packaging Extended High-Temperature Operation of Silicon Carbide CMOS Circuits for Venus Surface Application Journal of Microelectronics and Electronic Packaging, October 2016 Issue A. Matthew Francis, Jim Holmes,Nick Chiolino,Ian Getreu, Matthew Barlow, Affan Abbasi, and H. Alan Mantooth
A Design Kit for High Temperature ASIC and LTCC Co-Design
Ozark IC’s work in advanced packaging for high-temperature integrated circuits was a feature in the November/December issue of Advancing Microelectronics Magazine (an IMAPS publiction). A Design Kit for High Temperature ASIC and LTCC Co-Design Jim Holmes, A. Matt Francis, Ian Getreu, Matthew Barlow, Nick Chiolino, Michael Glover
Conference: WIPDA 2016 – SiC-CMOS Digital Circuits and More
Ozark IC attended the 2016 Workshop on Wide Bandgap Power Devices and Applications in Fayetteville, AR, November 2016. In addition to our booth, Matthew Barlow, Ozark IC Engineer, presented a hardware demonstration of a SiC-based power converter using Venus-tested circuits. Barlow, M., Francis, A. M., Chiolino, N., Holmes, J., Abbasi, A., & Mantooth, H. A. (2016). SiC-CMOS digital circuits for high temperature power conversion. In 2016 IEEE 4th Workshop on Wide Bandgap Power Devices and Applications (WiPDA) (pp. 223–227). https://doi.org/10.1109/WiPDA.2016.7799942