Ozark IC is your provider for rugged system solutions for all environments; from consumer grade to extreme duty.  Please browse each section to learn more about our capabilities.

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Come visit us at our booth at the 4th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA)

​Nov. 7–9, 2016, Fayetteville, Arkansas, USA  

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Novel Technologies

We utilize the best technology to solve your extreme environment problem.  From silicon/silicon-on-insulator to wide-bandgap IC's, we have the expertise to put your idea into hardware through standard parts, custom ASICs and rugged packaging.  

ASIC technologies include:

  • Silicon: -55 to 125 C
  • Silicon on Insulator: -180 to 225 C
  • Silicon Carbide: -55 to 500 C


  • Do you have a PCB and you need to save space? 
  • Need IC's that can take more than 3.3V?  
  • Operating over 200oC? 
  • Under -55oC?
  • Do you care about radiation?

We have the expertise to map your NEED to a TECHNOLOGY.

Design and Development

We offer a wide range of products and services to facilitate your design needs.

  • Modernize your Legacy Design
  • Rugged IC Components
  • Customized Printed Circuit Boards (PCB)
  • Customized Application Specific Integrated Circuits (ASIC)
  • Design Tools and Models - Desktop or web-facing

We can start from an idea, a netlist or even a napkin.  Check out our Services for more information.

Ozark IC looks at your problem, schedule and budget and determines the best solution. A preliminary system design is created and recommendations for the best implementation are made.  The best options for the implementations are identified 

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Our services.

Analog, Digital, Mixed-Signal Design

We have the expertise in analog, digital, mixed-signal design to solve your integrated circuit problems.  We can work with you to develop a specification, identify a manufacturing process, and develop anything from a single circuit or layout to a complete ASIC.

  • Full custom ASIC design
  • Physical design
  • Pad frame generation

Extreme Environment Testing

A ruggedized circuit has to work far beyond powerup on the bench.  We can help you qualify your component for wide temperature operation (pre- and post-packaging).  Thermal cycling, thermal shock, and wide temperature characterization are just some of the extreme environment capabilities we can offer. Need a unique automated test configuration?  We can help with custom drivers, hardware and software to solve your extreme environment testing needs.

Libraries, IP, PDKs

We've developed extensive analog, digital and mixed-signal gate libraries that can support rapid design composition.  We can also use our hardened IC know-how to produce a library to support your IC needs.

  • Logic libraries/Gate libraries
  • Custom IP development (amplifiers, references, data converters - you name it)
  • Custom Process Design Kits  (PDKs)
    • Extend an existing process for extreme environments
    • Develop an entirely new process

Design Techniques and Models

Extreme environments require extreme tools.  Off-the-shelf EDA won't cut it when you're pushing the limits.  We have developed new models, design rules and customized design tools to support rugged design activities.

  • Behavioral (system) models
  • Device characterization (temperature, radiation, etc)
  • Desktop, Server and Web-facing design and analysis tools

Mapping Technlogy to Need

Have an application and don't know where to start?  Give us an idea of electrical, temperature, power and cost needs and we can help you identify a solution that will meet your needs.  From simulation studies and ASIC specifications to full-blown custom ICs, we can help you navigate the myriad of choices that have to be made at the system, component and IC levels. 


Need a unique package?  Not sure what package, die attach, wire bond or board material to use?  We can help you pick a stack that will support your system and offer prototype packages in reasonable volumes with quick turns.


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Example products we have developed for customers include:



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About us.

Ozark IC was founded in 2011 by experts in design techniques, modeling and design tools for integrated circuits and systems on chip for extreme environments.  In fact, we helped write the book on it!

Our Vision

We provide best in class solutions for each problem we tackle.  While our focus is on extreme environment electronics, our broader vision is to map your need to one of our novel technologies.  We've successfully applied this methodology to problems ranging from custom rad-hard space-borne communications chips to customer-facing design portals for unconventional circuit components.  If you feel like your problem is not easily solved by mainstream technologies, please talk to us.

Our Approach

We believe strongly in top-down, model-based design.  This means spending the time up front to understand a) what the problem is (specification) and b) what technology or technologies best fit the problem in terms of function, form factor and cost.  In already complicated integrated circuits, adding the complications of wide-temperature, radiation, stress, strain, etc. that extreme environments require demands that you manage complexity through modeling, tooling and rigourous analysis - this is our speciality.

Our Team



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Resources and Information.

Wondering if a custom integrated circuit is for you?  Not sure what challenges to expect when you push a temperature range?  The web is awash with sources of information to these complicated questions, and here is a smattering of the best resources to help guide your decision making process.

Integrated Circuits

Extreme Environment Electronics





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Get in touch.

Interested in any of our products or services? Please feel free to contact us for more information.
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