Advanced Packaging

Advanced packaging:At High temp, the chips only scratch the surfaceOzark IC’s design capability doesn’t end at the IC – we co-design chips and substrates for wide temperature operationCeramic substrates based on LTCC technology for extended operation up to 300 C … Read More


Ozark IC’s patented Ultra Violet Sensors can operate up to 500 C, have the highest sensitivity and can be integrated into monolithic IC solutions.Works from -200 C to 500 CInherently visible- and IR- blind, so no back-side thinning or filtering … Read More

About Us

About Us Ozark IC was founded in 2011 by Matt Francis and experts in design techniques, modeling and design tools for integrated circuits and systems on chip for extreme environments.  In fact, we helped write the book on it!


What goes into an electronic module? A complete module is composed of Components, a Board (Substrate) and of course application software and programming depending on the system. Putting a system together is driven by your application needs.  The technologies that go into … Read More


High Temperature Photonics Advanced Packaging Consulting Technologies Our Services Mapping Technology to Need Have an application and don’t know where to start? Give us an idea of electrical, temperature, power and cost needs and we can help you identify a … Read More

High Temperature

Silicon Carbide CMOS Ozark IC  designs the most dense, low-power circuits that can operate across a 500oC temperature range using Silicon Carbide CMOS technology.Scalable from gate drivers to microcontrollersBest digital/analog/mixed-signal design expertiseDesigns from -180oC to 500oCProven specification-driven design approach for … Read More


Ozark IC is your provider for rugged system solutions for all environments; from consumer grade to extreme duty.  Please browse each section to learn more about our capabilities. Follow us