See you at OTC 2017!
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Come visit us at the NASA booth (5318) at the Offshore Technology Conference • 1-4 May 2017 • NRG Park • Houston, Texas, USA.  Ozark IC CTO Jim Holmes will be attending this week to discuss Ozark IC’s SiC technologies … Read More

Advanced Packaging
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Advanced packaging:At High temp, the chips only scratch the surfaceOzark IC’s design capability doesn’t end at the IC – we co-design chips and substrates for wide temperature operationCeramic substrates based on LTCC technology for extended operation up to 300 C … Read More

Sensors
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Ozark IC’s patented Ultra Violet Sensors can operate up to 500 C, have the highest sensitivity and can be integrated into monolithic IC solutions.Works from -200 C to 500 CInherently visible- and IR- blind, so no back-side thinning or filtering … Read More

About Us
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About Us Ozark IC was founded in 2011 by Matt Francis and experts in design techniques, modeling and design tools for integrated circuits and systems on chip for extreme environments.  In fact, we helped write the book on it!

Technologies
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What goes into an electronic module? A complete module is composed of Components, a Board (Substrate) and of course application software and programming depending on the system. Putting a system together is driven by your application needs.  The technologies that go into … Read More

Services
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High Temperature Photonics Advanced Packaging Consulting Technologies Our Services Mapping Technology to Need Have an application and don’t know where to start? Give us an idea of electrical, temperature, power and cost needs and we can help you identify a … Read More