Let Ozark IC be your mixed-signal/AMS solutions specialist. We can develop products scaling from prototype/evaluation quantity to supporting manufacturing 100,000’s of units. Our specialties include: Analog/Mixed-Signal board or IC design UV Optical High Temperature board and circuit designs (up to … Read More
Come visit us at the NASA booth (5318) at the Offshore Technology Conference • 1-4 May 2017 • NRG Park • Houston, Texas, USA. Ozark IC CTO Jim Holmes will be attending this week to discuss Ozark IC’s SiC technologies … Read More
Congrats to Ashfaq Rahman (PhD student of Dr. Alan Mantooth), a member of the U of A/Ozark IC design team from the Building Innovation Capacity NSF collaboration on his new paper, “High Temperature Data Converters in Silicon Carbide CMOS,” that has … Read More
Ozark IC’s work in Silicon Carbide CMOS integrated circuits was recently featured in the IMAPS Journal of Microelectronics and Electronic Packaging Extended High-Temperature Operation of Silicon Carbide CMOS Circuits for Venus Surface Application Journal of Microelectronics and Electronic Packaging, October 2016 … Read More
Advanced packaging: At high temp, the chips only scratch the surface Ozark IC’s design capability doesn’t end at the IC – we co-design chips and substrates for wide temperature operation Ceramic substrates based on LTCC technology for extended operation … Read More
Ozark IC’s patented Ultra Violet Sensors can operate up to 500°C, have the highest sensitivity and can be integrated into monolithic IC solutions. Works from -200°C to 500°C Inherently visible- and IR- blind, so no back-side thinning or filtering required … Read More
About Us Ozark IC was founded in 2011 by Matt Francis and experts in design techniques, modeling and design tools for integrated circuits and systems on chip for extreme environments. In fact, we helped write the book on it!
What goes into an electronic module? A complete module is composed of Components, a Board (Substrate) and of course application software and programming depending on the system. Putting a system together is driven by your application needs. The technologies that go into … Read More