Congrats to Ashfaq Rahman (PhD student of Dr. Alan Mantooth), a member of the U of A/Ozark IC design team from the Building Innovation Capacity NSF collaboration on his new paper, “High Temperature Data Converters in Silicon Carbide CMOS,” that has … Read More
Ozark IC’s work in Silicon Carbide CMOS integrated circuits was recently featured in the IMAPS Journal of Microelectronics and Electronic Packaging Extended High-Temperature Operation of Silicon Carbide CMOS Circuits for Venus Surface Application Journal of Microelectronics and Electronic Packaging, October 2016 … Read More
Advanced packaging: At high temp, the chips only scratch the surface Ozark IC’s design capability doesn’t end at the IC – we co-design chips and substrates for wide temperature operation Ceramic substrates based on LTCC technology for extended operation … Read More
Ozark IC’s patented Ultra Violet Sensors can operate up to 500°C, have the highest sensitivity and can be integrated into monolithic IC solutions. Works from -200°C to 500°C Inherently visible- and IR- blind, so no back-side thinning or filtering required … Read More
What goes into an electronic module? A complete module is composed of Components, a Board (Substrate) and of course application software and programming depending on the system. Putting a system together is driven by your application needs. The technologies that go into … Read More
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