In support of clean energy applications of its SiC technologies, Ozark IC is happy to announce it has joined the Arkansas Advanced Energy Association!
Ozark IC is excited to participate in the Fayetteville Startup Crawl! The Startup Crawl is the biggest startup party of the year highlighting the Downtown Innovation District in the Startup City of the South. Everyone is invited to come out and tour local startups at this incredible, one-night celebration of technology and entrepreneurship! Get ready to crawl your way through […]
Ozark Integrated Circuits Inc., a technology firm located in the Arkansas Research and Technology Park at the University of Arkansas, has received a $750,000 award from the U.S. Air Force. The grant is to develop electronics packaging and assembly systems for controls in jet engines. The controls can operate at temperatures up to 300 degrees […]
Ozark IC attended and discussed our work with NASA at ASBTDC’s “Doing Business with NASA” event Thursday, July 20th. http://ualr.edu/news/2017/06/19/doing-business-with-nasa/
94: Engineering the Future with Ozark IC Jul 17, 2017 If you like engineering, then you’re going to love this one! This week we welcome Matt & Jim from Ozark IC. We discuss their work with semiconductors, and how the future is powered by engineering. Their company has received grants from NASA, so they know […]
Come visit us at the NASA booth (5318) at the Offshore Technology Conference • 1-4 May 2017 • NRG Park • Houston, Texas, USA. Ozark IC CTO Jim Holmes will be attending this week to discuss Ozark IC’s SiC technologies for downhole exploration.
Ozark IC’s work in Silicon Carbide CMOS integrated circuits was recently featured in the IMAPS Journal of Microelectronics and Electronic Packaging Extended High-Temperature Operation of Silicon Carbide CMOS Circuits for Venus Surface Application Journal of Microelectronics and Electronic Packaging, October 2016 Issue A. Matthew Francis, Jim Holmes,Nick Chiolino,Ian Getreu, Matthew Barlow, Affan Abbasi, and H. Alan Mantooth
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Ozark IC’s work in advanced packaging for high-temperature integrated circuits was a feature in the November/December issue of Advancing Microelectronics Magazine (an IMAPS publiction). A Design Kit for High Temperature ASIC and LTCC Co-Design Jim Holmes, A. Matt Francis, Ian Getreu, Matthew Barlow, Nick Chiolino, Michael Glover
Ozark IC attended the 2016 Workshop on Wide Bandgap Power Devices and Applications in Fayetteville, AR, November 2016. In addition to our booth, Matthew Barlow, Ozark IC Engineer, presented a hardware demonstration of a SiC-based power converter using Venus-tested circuits. Barlow, M., Francis, A. M., Chiolino, N., Holmes, J., Abbasi, A., & Mantooth, H. A. (2016). […]